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Chip bonding process analysis of crack caused by the thimble
Chip crack is one of the most serious failure mode of semiconductor devices, due to the severity and position of crack effect was discovered in time under the condition of certain die crack is not easy, welding in the product or product later in the work process, crack extension, eventually leading to device failure, which brings risks to the quality and reliability of products. Factors causing die crack is various, this article mainly TO-252 package appearance as an example, discusses in the back of the process, due to improper use or damage thimble thimble, analysis of chip cracks, and verified by experiments.
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