microchip dspic33e series mcu
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Chip analysis steps
1 usually do the first look to see if there is no burnt, mark crack what, take pictures;
2 non-destructive analysis: mainly ultrasonic scanning microscope (C-SAM) - to see there is no xray--, delamination look at the internal structure, etc.;
3 electric measurement: the main tool, the universal meter, oscilloscope, tek370a Sony, now seems to be 370b;
4 destructive analysis: mechanical decap, chemical decap chip.
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